Examples of Testing of Electronic Components/
Electronic Devices

Examples of Available Testing Services

• Package Opening

  

• Observation of Solder Bump by Micro-Focus X-ray Analyzer

  Accuracy in nondestructive investigation not only increases accuracy in the following destructive investigation, but enables short TAT in defect analysis. The following example shows the area around a solder bump, which was observed by using a micro-focus X-ray analyzer.

  

• Solder Wettability Test by Meniscograph

  "Lead-free" soldering involves a large number of problems which depend on solder wettability, such as the solder composition, flux material, base metal plating conditions, sample shape, etc. The meniscograph method is a dynamic wettability testing method which measures dynamic force (change of force over time) by using a sample on which flux is dispersed as a sample that is immersed to a fixed depth at a constant rate.