Analyses and Reliability Evaluations of Electronic Materials/Mounted Components in Semiconductors

JFE-TEC undertakes analysis and reliability evaluation of joining (solder, wire bonding, die bonding, and interlayer joining), short circuit/wire breakage, exfoliation, corrosion, migration, etc. of power device, IC and other mounted components of electronic part.

Analysis of Joining, Short Circuit/Wire Breakage, Exfoliation, Corrosion, and Migration of Mounted Components

JFE-TEC undertakes analysis of joining (solder, wire bonding, die bonding, and interlayer joining), short circuit/wire breakage, exfoliation, corrosion, migration, etc. of power device, IC and other mounted components of electronic part.

Morphological observation: surface observation, section observation

Elementary analysis: analysis of surface and section

Chemical state analysis

  • Analysis of Sn plating discolored layer using XPS

Crystalline structure analysis

  • Orientation analysis of whisker using EBSD
  • Orientation analysis of metallic electrode using EBSD

Reliability Test/ Failure Investigation of Electronic Parts/Devices

JFE-TEC undertakes cause analyses of problems and failures in LSI products, single electronic components, mounted substrates and electronic components, and evaluate their reliability. We quickly and accurately conduct evaluation of reliability of solder joining portions associated with disuse of lead.

Connector

Printed circuit board

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