Analyses of Thin Film and Surface Treatment

Functionalities of thin film materials and surface treatment materials (friction, sliding, press property, corrosion resistance, color, electronic physical property, magnetic property, optical characteristics, etc.) vary depending on the surface treatment, surface structure and film structure of thin film, and the interface structure. JFE-TEC provides structure analysis techniques necessary for material design and failure analysis.

Film and Surface

We investigate the crystalline morphology of surface treatment and thin film, coating state through section observation, composition and chemical state of lamination through observation, and the crystalline phase and orientation and then analyze the change of film after use, deterioration, and evaluation of functionalities.

Morphological observation

Elementary analysis

Chemical state analysis

  • Analysis in depth direction of Si oxide/metal Si on steel sheet using AES
  • Analysis of Cr morphology in tin plating for can
  • Analysis of chemical state of Cr in chromate layer using XPS
  • Oxidation state of color-changed Sn plating using XPS
  • Analysis of sp2/sp3 in DLC film using EELS
  • Analysis of electron state in non-crystalline WO3 thin film

Crystalline structure analysis

Interface (Surface Treatment/Thin Film, Base Material/Substrate), Multilayer Structure, Alloy Layer, Diffusion Layer, and Reaction

We analyze the multilayer interface of surface treatment film, thin film, alloy layer, reaction layer, and the diffusion layer of interface morphology of the base material.

Morphological observation

  • Observation of multilayer thin film lamination structure using ULV-SEM
  • Identification of interlayer exfoliation inter face using ULV-SEM
  • Observation of multilayer polymer film using ULV-SEM
  • Atomic-scale observation of lamination state of LED super lattice structure (MQW) using TEM
  • Observation of alloy phase of metallic plating/base material interface (FeZn/steel/Sn plating/Cu, etc.) using TEM

Element analysis

  • Identification of intermetallic compound in solder plating/Ni plating interface using SEM
  • Analysis of electrode surface sliding layer using Cs corrector STEM and TEM
  • Analysis of ceramic spray/substrate interface using Cs corrector STEM
  • Analysis of stainless steel passive film using Cs corrector STEM-EDX/EELS
  • Atomic-level mapping analysis of lamination condition of LED super lattice structure (MQW) using Cs corrector STEM- EELS/EDX 

Chemical state analysis

  • interface of SiC-based power device MOSFET using Cs corrector STEM and TEM

Crystalline structure analysis

Inquiry about Products and Services

Click here for inquiries regarding services:

  • Inquiry Form
  • Ordering Procedure